Description
Very thick thermal pad (8 mm) for use with the HOT300 Large Backplate
Specification
- Dimensions 150 x 100 x 8 mm
- Thermal Conductivity 6 W/mK
- Continuous Temperature Usage -40 to 200 °C
- Volume Resistivity > 100 GΩcm
- Dielectric Breakdown Voltage > 5 kV